简介:在80%Al-20%CuO(质量分数)体系中,通过原位反应法制备Al2O3p-Al复合材料。采用不同方法研究CuO颗粒粒度对复合材料合成温度和显微组织的影响。结果表明,CuO颗粒粒度对Al-CuO体系的完全反应温度有显著影响:含有粒度小于6μmCuO颗粒样品的完全反应温度比含有粒度小于100μmCuO颗粒样品的完全反应温度低200°C。当反应温度低于某一临界值时,原位Al2O3颗粒和Al基体之间不能完全结合;当温度高于某一临界值时,原位Al2O3颗粒的形貌从棒状转变成近球形。这两个临界温度受CuO颗粒粒度的影响:含有粒度小于6μmCuO颗粒样品的临界温度比含有小于100μmCuO颗粒样品的临界温度低100℃。
简介:IntroductionIn2O3·Snfilmshavehightransparency(>95%)withinthevisiblespectralregion,lowresistivity(10-2—10-4ohm·cm)atroomtemperatureandsuperiorthermalstability.Thesefilmshavebeenappliedtosolarcells,electronicsandphotoelectronicsfields.Inrecentyears,organometallic-CVDmethodhasemergedasasuccessfulalternatetothephysicalmethodsandgeneralCVDforthegrowthofthesefilms.TheMO-CVDtech-
简介:Zinctinoxide(ZTO)thinfilms,withzincacetateandtributyltinchlorideasrawmaterials,weredepositedonglasssubstratesbythemethodofmetalorganicchemicalvapordeposition(MOCVD).Thecrystallization,microstructureandopticalpropertieswereinvestigatedbyscanningelectronicmicroscope(SEM),X-raydiffraction(XRD)andultraviolet-visible(UV-Vis)spectrophotometer.TheresultsshowthatwiththeincreaseinSn/Znratio,thecrystalchangesfromwurtzitetorutilephase.Whentheratioreaches11:18,theintensityofZn_2SnO_4peaksappearstobethestrongestandtheopticalbandgapisabout3.27eV.Calculatedbytheenvelopemethod,thethicknessoftheZTOthinfilmsis713.24nm.MeasuredbyUV-Visspectrophotometer,thetransmittanceoftheZTOthinfilmsreachesupto80%inthewavelengthrangeof400-1000nmwhentheSn/Znratiois7:18.
简介:采用化学还原共沉积法制备SnxNiyCoz(x∶y∶z=4∶3∶1.5,4∶2∶1,4∶2∶2,4∶1∶2)三元合金材料,通过充放电测试对比材料的电化学性能。结果表明:呈较均匀分散性和表面疏松的Sn4Ni2Co材料的电化学性能最好;第20次循环,Sn4Ni2Co合金电极可逆容量为346mAh.g-1,库仑效率为94.2%。
简介:1IntroductionDengfuxianorefieldliesattheintersectionoftheQin-HangCombinedZone(QCZ)andtheNanlingMetallogenic,andcomprisesXiangdongW-Sndeposit(AlsoknownasDengfuxianW-Sndeposit),Jiguanshi
简介:ThemicrostructureandtensilepropertiesofSn-9Znsolderunderdifferentcoolingandagingconditionwerestudied.Duringsolidification,thedistributionofZn-richphasesandgrainsizeinthemicrostructureofSn-9Znsolderweredecidedbythecoolingrate.TheZn-richphaseinSn-9Znsolderunderfurnacecooling,aircoolingandwatercoolingmediawasseparatelyexistedascoarsendendriticandneedlelikeshape,fineneedlelikeshapeandveryfinerod-likeshape,respectively.Afteraging,thecoarsendendriticwasbrokenandthecoarsenneedlelikeZn-richphasewaspartlychangedintofinedistributionofZn-richphaseforSn-9Znsolderwithfurnacecooling,andtherod-likeZnphaseintheSn-9ZnsolderunderwatercoolingwaschangedtoconglomeratedZnwithneedleshape.DuringtensiletestingonSn-9Znsolder,tensilestrengthandductilityreachedthebestwithwatercooling,butdecreasedwithagingeffect.Meanwhile,theductilityofsolderwithaircoolingandthestrengthofsolderwithfurnacecoolingincreasedwithaging.Thefracturemodewasductileandwasindependentofcoolingmediaandagingeffect.Thesizeanddepthofdimplesdecreasedfromwater,furnacetoaircooling.Afteraging,numberandsizeofdimplesincreasedonthesolderwithfurnacecoolingandaircooling.ThechangeonthesizeofdimplesfortheSn-9Znsolderunderdifferentcoolingconditionandwithagingeffectwasaccordancetothetensileproperties.
简介:Chemicalreductionmethodwasemployedtopreparenano-sizedSn2SbNialloycompositesusedasanodematerialforrechargeablelithiumionbatteries.Thisstrategywasadoptedtocombinethevirtuesofbothactive/inactiveandactive/activealloystofabricateaSn2SbNialloypowderwithtwoactivecomponentsandoneinactivecomponent.Thetwoactivecomponentscanrealizethehighcapacityfeatureofelectrodeandcanmakethevolumechangeofelectrodetakeplaceinastepwisemannerduetothedifferentlithiationpotentialsoftwoactivecomponents,leadingtoastablecyclingperformance.Sn2SbNialloyprovidesareversiblespecificcapacityover640mA·h/gwithanexcellentcyclicability.TheSn-Sb-Nialloycompositematerialshowstobeagoodcandidateanodematerialforthelithiumionbatteries.
简介:研究Sb元素含量对Sn-Bi系焊料性能的影响。通过差示扫描量热法研究Sn-Bi-Sb焊料的熔化行为。采用铺展实验研究焊料在Cu基板上的润湿性。测试Sn-Bi-Sb/Cu结合界面的力学性能。结果表明:三元合金中含有包共晶反应形成的共晶组织,随着Sb含量的增加,共晶组织增多;在加热速率为5℃/min的条件下,三元合金显示出更高的熔点和更宽的熔程;添加少量Sb对Sb-Bi系焊料的铺展率有影响;在焊料铺展过程中形成反应过渡层,反应过渡层中存在Sb元素而无Bi元素,过渡层厚度随着Sb元素含量的增加而增大。Sn-Bi-Sb焊料的剪切强度随着Sb元素含量的增加而升高。
简介:[篇名]InfluenceofWCadditionanmicrostructuresoflaser-meltedNi-basedalloycoating,[篇名]MicrostructureanddryslidingwearbehavioroflasercladNi-basedalloycoatingwiththeadditionofSiC,[篇名]PreparationofAdvancedLithiumSecondaryBatterieswithTin-IronAlloyPlatingAnodesandTheirCharge-DischargeBehaviors,[篇名]SnAg-alloycoatingforconnectorsandsolderingapplications,[篇名]Structureandpropertiesofwear-resistanttitaniumcarbonitride-basedcoatings,[篇名]TheanalysisofthedepositionmechanismofZn/NialloyplatingusinganEQCM,[篇名]Theeffectofheattreatmentonwearresistanceofpartshavinghard-alloycoating.
简介:AdvancedLithiumSecondaryBatteriesUsingTin-IronAlloyNegativeElectrodesPreparedbyElectroplating;CavitationerosionofTi-Nishapememoryalloycoating;Effectsoffueldyeonthehotcorrosionresistanceofmarinegasturbinematerials;EffectsofphosphorouscontentsandambienthumidityonthefrictionandwearpropertiesofNi-W-PalloyplatingFrictionandwearofelectrolessNialloyplatedgearundernon-lubricationconditioninhighvacuum
简介:五峰合金有限责任公司是在五峰铁合金厂的基础上,由湖北天宇电业集团控股、县财政局、员工持工基金会共同出资于一九九八年初组建的有限责任公司。公司注册资本金800万元,现有资产总值1700万元,企业员工人数280名,其中,大中专毕业生41名,专业技术人员43名,党员18名,拥有3200KVA硅铁电炉2台,1000KVA和630KVA硅钙电炉各2台,形成了年生产硅铁4400吨、硅钙1000吨的生产能力,
简介:ACOUPLEDMACRO-MICROSIMULATIONFORTHEPREDICTIONOFMICROSTRUCTUREOFALALLOYCASTINGS,AstudyonporositydistributionofA356aluminumalloycastings,Diagnosisofoxidcfilmsbycavitationmicro-jetimpact,Effectofflyash(asanadditivetogreensand)onthesurfaceroughnessofAl-7%SialloycastingsusingTaguchiTechnique,EffectofSolidificationTimesonCrackOpeningDisplacementofAluminumAlloyCastings,EvaluationofinversesegregationinCu-8mass%Sialloyingotwithvisiblelightspectroscopy.
简介:基于微观相场模型,通过分析Ni75AlxV25-x合金在沉淀过程中D022(Ni3V)相沿[001]方向形成的有序畴界面的界面结构、界面迁移及界面成分,研究界面结构对界面迁移特征和溶质偏聚的影响。研究表明:D022相沿[100]方向形成4种有序畴界,界面的迁移性与界面结构有关,除具有L12相的局部特征的界面(001)//(002)之外,其余3种界面都可以迁移;在界面的迁移过程中,V原子跃迁至最近邻的Ni位置并置换Ni原子,反之亦然,即处在最近邻的Ni原子和V原子发生位置交换而导致界面迁移;在迁移过程中,原子的跃迁行为具有位置选择性,每种可迁移界面都按照特定的原子跃迁模式进行迁移;原子在跃迁过程中选择最优化的路径使得界面发生迁移,原子跃迁过程中的位置选择性使得界面在迁移前、后的结构保持不变;合金元素在界面处具有不同的贫化和偏聚倾向,在所有的界面处,Ni偏聚而V贫化,Al在界面(001)//(001)·1/2[100]处贫化在其他界面处偏聚;同种合金元素在不同界面处的偏聚和贫化程度不同。