简介:SY509-3-01[篇名]Characterizationofsaltparticle-inducedcorrosionprocessesbysynchrotron-generatedX-rayfluorescenceandcomplementarysurfaceanalysistools;SY509-3-09[篇名]ChemicalandElectricalTechniquesforConditionAssessmentofCompositeInsulators;……
简介:[篇名]AFeasibleSIMSStudyforCharacterizingFerricOxyhydroxidesFormedontheIronSurfaceUsingDeuterium,[篇名]AfundamentalstudyonthefatiguebehaviorofahighV-Cr-Nicastiron,[篇名]Alaboratorysimulationforstick-slipphenomenaonthehydrauliccylinderofaconstructionmachine,[篇名]Aperturbationtechniqueforflow-inducedvibrationcontrol,[篇名]Apicosecond14.7nmX-raylaserforprobingmatterundergoingrapidchanges,[篇名]Astudyofcontact-start-stopweartracksbyTOPSIMS,[篇名]ADCP-basedmulti-directionalwavegaugeandcurrentprofiling。
简介:AnodisationofaNb-Zralloy;Applicationofdiscreteeventsimulationforrobustsystemdesignofameltfacility;ATOMICFORCEMICROSCOPYSTUDIESONMORPHOLOGYANDDISTRIBUTIONOFSURFACEMODIFIEDSILICAANDCLAYFILLERSINANETHYLENE-OCTENECOPOLYMERRUBBER;Capturingstrainlocalizationbehindageosynthetic-reinforcedsoilwall
简介:[篇名]ADVANCEDLASERAPPLICATIONSINMICROELECTRONICSANDDATASTORAGEDEVICES(INVITED),[篇名]ANNEALINGTEMPERATUREDEPENDENCEOFCONTACTRESISTANCEANDSTABL1TYFORTi/AI/Pt/AuOHMICCONTACTSTOBULKn=ZaO,[篇名]Applicationsofthermographyintheassessmentofmasonry,airportpavementsandcompositematerials,[篇名]BulkPlasmaProductionUsingGaseousDischargeSystemwithExternalElectronInjection,[篇名]CharacterizationOfNano-MeterScaleRoughnessOfCVDSiliconAndSiliconDioxideFilmsFor3-DDeviceIntegration,[篇名]CLEANINGOFTHESURFACEOFSILICONSTRUCTURESINTHETECHNOLOGYOFVERYLARGE-SCALEINTEGRATEDCIRCUITSWITHTHEUSEOFRAPIDHEATTREATMENT,[篇名]Effectsofactiveelementsonoxideremovalbyavacuumarc。
简介:[篇名]64-Channelextendedgateelectrodearraysforextracellularsignalrecording,[篇名]ANewDesignforCoatingThinFilmAluminaonStainlessSteelforBiomedicalApplications,[篇名]Anewdevelopmentofpolymer/metaloxidehybridparticles,[篇名]Anewsurfacemodificationmethodtoalleviatestictionofmicrostructures,[篇名]Anewtechniqueforsurfacemodificationinmagnesiumalloysbyapplyingmagnesiumoxidecoating,[篇名]AdhesionMechanismatMetal-OrganicInterfacModifiedbyPlasma,[篇名]AminatedPolyacrylonitrilcFibersforHumicAcidAdsorption:BehaviorsandMechanisms。
简介:摘要:本研究深入探讨了表面安装技术(Surface Mount Technology,SMT)在电子装配领域的最新技术创新及其广泛应用。随着电子设备向更小型化、高性能化发展的需求不断增加,SMT作为一种先进的电子元件装配技术,展现出其关键作用。研究首先介绍了贴片机技术的新进展,包括其在放置精度、装配速度和元件兼容性方面的显著提升。进一步,本文分析了无铅焊料和低温焊接等新型焊接材料与技术如何提高了SMT的环境友好性和焊接质量。同时,自动化和智能化的检测技术在提高产品可靠性方面的应用也得到了详细探讨。此外,研究还着重于SMT技术在航空航天、智能穿戴设备以及物联网设备等高可靠性要求领域的应用,以及其在推动电子制造业绿色环保和可持续发展方面的贡献。通过对SMT技术创新及应用的全面分析,本文旨在为电子装配技术领域的研究和实践提供参考和启示。