简介:ProblemsaboutsurfacemountingprocessforfinepitchdevicesandreasonsonsolderbridgingofLtypeleaddevicesweldedaredepicted.Bridgingmechanismandinfluencefactorsareanalyzedwithtwo-dimensionalgeometricmodel.Basedonthis,high-densitysurfacemounttechnology(SMT)forfinepitchLtypeleaddevicesheatedbyscan-ninglaserisraised.SurfacemountprocessforQFP208onprintedcircuitboard(PCB)isstudied.Theresultsoftestsarethatitisquitepossibletosolvethesolderbridgingofsurfacemountingforpitchdeviceswithscanninglaser-heat-ingmethod.
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简介:macroporous的吸着性质为La3+离子的弱酸树脂(D113)被化学分析和红外系列学习。试验性的结果显示D113树脂在pH=为La3+有一个好吸附能力6.0在HAc-NaAc媒介。静态地浸透的吸附能力是273.3mg/g。La3+/Ce3+,La3+/Gd3+,La3+/Er3+,和La3+/Y3+的分离系数分别地是2.29,3.64,4.27,和0.627。吸附的明显的激活精力,Ea是吸着的18.4kJ/mol,热力学参数H,S,和G是4.53kJ/mol,61.8J/(mol.K),?13.9kJ/mol分别地。为La3+的D113的吸附行为服从Freundlich等温线。在树脂上吸附的La3+能是由2.0mol/LHCl份量上的eluted。