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Electronic packaging materials prepared by powder injecting molding and pressure infiltration process

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摘要 AlSiCp(65vol.%原文如此)电子包装材料被塑造的粉末注射(PIM)和压力渗入过程生产以便获得近塑造网的部分。泉华pre过程在1150K获得的SiCppreformed协议高有力量和好外观，和到全部的孔的开的孔的比率是将近98%。composites的相对密度比99%大。这个方法制作的AlSiCpcomposites的热传导性是198W.m?1.K?1，并且热扩大(CTE)的系数是8.0x10?6/K(298K)。

DOI kd2nq5v0d6/564986

作者 YIN Fazhang;GUO Hong;JIA Chengchang;XU Jun;ZHANG Ximin;ZHU Xuexin

机构地区不详

出处《稀有金属：英文版》 2007年6期

关键词复合材料铝微机构导热性

分类 [金属学及工艺][金属材料]

出版日期 2007年06月16日（中国期刊网平台首次上网日期，不代表论文的发表时间）

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来源期刊

稀有金属：英文版

稀有金属：英文版

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复合材料铝微机构导热性

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