Cellular Spacing Selection of Cu-Mn Alloy under Ultrahigh Temperature Gradient and Rapid Solidification Condition-中国期刊网

摘要 CellularspacingselectionofCu-27.3wtpctMnalloyhasbeeninvestigatedbylasersurfacerapidresolidificationexperiments.Theexperimentalresultsshowthatthereexistsawidedistributionrangeincellularspacingunderultra-hightemperaturegradientandrapidsolidificationconditionsandtheaveragespacingdecreasewithincreaseofthegrowthrate.TheexperimentalresultsarecomparedwiththecurrentKGTmodelforrapidcellular/dendriticgrowth,andareasonableagreementisfound.

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Cellular Spacing Selection of Cu-Mn Alloy under Ultrahigh Temperature Gradient and Rapid Solidification Condition

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Cellular Spacing Selection of Cu-Mn Alloy under Ultrahigh Temperature Gradient and Rapid Solidification Condition

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